作者：Zheng Yun, Liu Dajian, Dai Daoxin；等
来源：SCIENCE 卷:381 期:6654 页:221-226 出版时间:JUL 2023
We demonstrate a multichip multidimensional quantum entanglement network based on mass-manufacturable integrated-nanophotonic quantum node chips fabricated on a silicon wafer by means of complementary metal-oxide-semiconductor processes. Using hybrid multiplexing, we show that multiple multidimensional entangled states can be distributed across multiple chips connected by few-mode fibers. We developed a technique that can efficiently retrieve multidimensional entanglement in complex-medium quantum channels, which is important for practical uses. Our work demonstrates the enabling capabilities of realizing large-scale practical chip-based quantum entanglement networks.
